
Specifications
2,500 psi
Metal; Ceramic; Wood
200 °F
-40°F
Bonding Metal, Ceramic, Wood and Vertical Surface where gap-filling is needed
Epoxy
Devcon
400 mL
Adhesives & Glues
Epoxy
Opaque
440 V/mil
0.05
15 m@72°F
400 °F
7 d @ 75 °F
1/4 in
80 Shore D
Devcon
Thixotropic Gel
Low
Cartridge
Gel
1:1
Solvent; Water; Moisture
1.1- 1.3
200 °F
-40°F
2,500 psi
Adhesive
Bonding; Gap Filling
10,000 cp
7 min
4 min
4-7 min